| 摘要 |
PURPOSE:To improve the reliability of a semiconductor device at the time of allowing it to stand for at a high temperature by sealing a semiconductor element with epoxy resin composition which contains epoxy resin, phenol resin, third phosphine compound, and hydrate oxide of transition metal having 3-5 of atomic valence. CONSTITUTION:Epoxy resin composition is produced by mixing epoxy resin, phenol resin, third phosphine compound and hydrate oxide of transition metal having 3-5 of atomic valence. Then, a semiconductor element is sealed with the composition. When organic phosphorus of third phosphine compound and the hydrate oxide of transition metal having specific atomic valence are combined, flame resistance is imparted to the resin, and even if it is allowed to stand for a long period in a high temperature atmosphere, the production of an alloy due to the generation of hydrogen bromide does not occur to enhance the heat resistance reliability to high temperature left. Thus, this device can be preferably used for the utility of leaving it at high temperature like an outdoor equipment.
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