| 摘要 |
PURPOSE:To allow a thick silicon-compound film to adhere firmly to a resin body in a superior state, by introducing vapor into a vacuum tank evacuated to a specific pressure so that a specific partial pressure is reached and then heating silicon monoxide at the time of vacuum-depositing silicon oxide on a resin body. CONSTITUTION:The inside of a vacuum tank 1 is evacuated to <=1X10<-5>Torr and then maintained so that vapor partial pressure or nitrogen-gas partial pressure becomes 5X10<-5>-5X10<-4>Torr by introducing vapor or a nitrogen gas. A copper hearth 3 is heated in the above state to evaporate silicon monoxide 4 and DC voltage is impressed on an ionization electrode 5 to ionize a part of the silicon monoxide 4 by means of arc discharge, and then negative DC voltage is impressed on a substrate so as to coat a resin body 7 with the silicon monoxide 4. In this way, the thick film of silicon compound can be formed on the resin body 7 with firm adhesion without causing cracking and peeling.
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