| 摘要 |
PURPOSE:To enable any defect to be visually detected simultaneously with the disort process for judging the electrical acceptability by a method wherein an opening is made in one end of fine linear patterns continuously formed along the peripheral edge of surface to provide electrode pads connected to the fine linear patterns on the opening end. CONSTITUTION:Fine lined patterns 5 are continuously formed along the peripheral edge of surface while an opening is made in one end of the fine linear patterns 5 to provide electrode pads 6 connected to the fine linear patterns 5 on the opening end. The fine lined patterns 5 provided on the surface are designed to be disconnected whenever either a semiconductor chip 2 or one of pads 3 is subjected to a defective part, while the electrode pads 6 connected to the wiring patterns 5 is supplied with current so that any short circuit or disconnection of these wiring patterns 5 may be electrically detected to visually judge the acceptability of semiconductor chip 2. Thus, acceptability can be visually judged easily and surely simultaneously with the functional test of semiconductor chip during the disort process.
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