| 摘要 |
PURPOSE:To remove reliably dusts by a method wherein a film is formed on the surface of a semiconductor substrate to take the dusts on the surface in the film by the cohesive force of the film and the film is peeled from the surface after being dried. CONSTITUTION:A thin film 3 is formed on the surface of a semiconductor substrate 2 and dusts 1, 1... on the surface are taken into the film 3 utilizing the cohesive force of the film 3. By peeling the film 3 from the surface of the substrate 2 after the film is dried, the dusts 1 are attractingly removed. Thereby, the dusts 1 are reliably removed.
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