| 摘要 |
PURPOSE:To make decoding of preset digital codes difficult and to improve security protection, by using a semiconductor element having a bump electrode structure as a semiconductor element, and setting the digital codes with a specified digital code setting means. CONSTITUTION:Bump electrodes (a)-(f) for pattern codes are removed by using an external means, e.g., a laser light projecting device. Namely, the bump electrodes are removed for data '1'. The bump electrodes are made to remain for data '0' and working is performed. A semiconductor element 1, in which a pattern code part 12 is set, is attached to a land 11 for the bump electrodes in accordance with the above described working procedure. Electrodes are connected by using a reflow tank. After a circuit substrate is assembled in this way, a colored coating material is applied so as to cover the entire semiconductor element. Thus protection and moisture resistance of the semiconductor element 1 are improved. Digital codes are set by above described way. The configurations of the circuit substrates are approximately equal even if the circuit constitutions of electronic control apparatuses are different. Thus the codes cannot be decoded unless the bump electrodes of the semiconductor element 1, which is mounted on the circuit substrate, are investigated by using a special apparatus.
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