| 摘要 |
Process comprises contacting catalytic substrate with a soln. of pH 11-14 contg. a gold complex, pref. potassium gold cyanide, a copper complex, pref. using an ethylene diamine tetra-acetic acid tetra sodium salt as the complexing agent, formaldehyde or a formaldehyde producing compound and an alkali metal hydroxide, where the gold complex has a complexing constant 100,000 times that of the copper complex. Process is carried out at normal temps. and does not produce any corrosive or anoxious byprods. Method can be used for producing gold layers or patterns on printed circuit boards non- conducting substrates and esp. semiconductors using a III-V compound as base material.
|
