| 摘要 |
PURPOSE:To provide the titled composition composed of a compound containing active hydrogen and a polymethylene polyphenyl polyisocyanate, capable of forming a coating film to give an insulated wire, having excellent characteristics and suitable for electrical or electronic apparatuses, etc. CONSTITUTION:The objective composition having excellent soldering resistance and heat-resistance can be produced by compounding (A) a compound containing active hydrogen, having a hydroxyl value of >=300 and containing polyhydric alcohol in large excess, i.e. having a dicarboxylic acid/polyhydric alcohol molar ratio of 0.25-0.6 with (B) a polymethylene polyphenyl polyisocyanate of formula (n is 0, 1 or 2) at an OH/NCO equivalent ratio of 0.3-1.3 and a polymer concentration of >=90%.
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