| 摘要 |
PURPOSE:To obtain the titled composition, having excellent thixotropy and suitable as a sealing material for electronic parts, etc., by blending a liquid epoxy polymer with an inorganic filler and dibenzylidenesorbitol, etc., in a specific proportion. CONSTITUTION:A composition obtained by blending (A) a liquid epoxy polymer with (B) >=10wt.% inorganic filler (e.g. hydrated alumina), (C) 0.1-3wt.% dibenzylidenesorbitol and (D) a thixotropy imparting agent (e.g. ultrafine particulate silica or organic bentonite). Furthermore, the component (C) is preferably used by previously swelling with heat, etc., in the component (A).
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