| 摘要 |
PURPOSE:To facilitate forming a small diameter through-hole in a metal plate and avoid the electrical insulation defect of the through-hole by a method wherein a plurality of the metal plates in which the through-holes are drilled are laminated and bonded to each other through intervention of resin adhesive layers while the respective through-holes are aligned. CONSTITUTION:A plurality of metal plates 2 in which through-holes 1 are drilled are laminated and bonded to each other with intervening resin adhesive layers 3 while the respective through-holes 1 are aligned. At that time, the through- holes 1 are filled with resin 4 of the parts of the resin adhesive layers 3 and a common through-hole 5 is drilled in the resin 4 filling the through-holes 1. Therefore, by employing a plurality of metal plates 2 laminated and bonded to each other, thin materials can be used as the respective metal plates 2. With this constitution, the respective through-holes can be filled with resin without filling defect and the electrical insulation defect between the inner circumference of the common through-holes and the metal plates caused by voids created in the through-holes can be avoided. |
