| 摘要 |
PURPOSE:To provide a semiconductor chip package having improved shock resistance and capable of quickly dissipating heat generated in the semiconductor chip, by eliminating any projecting part of the package which impedes transfer thereof while flattening the periphery on which a lead frame is mounted indepen dently from depth of a recess in which the semiconductor chip is mounted or of thicknesses of used metallic plates. CONSTITUTION:A package 16 for an integrated circuit has a double structure in which upper and lower plates 16a and 16b are joined with each other at an interface 40. Any part of the package 16 that may be brought into contact with a lead frame (not shown in the figure) to be carried thereon is electrically insulated with a metal oxide layer or the like. The insulated parts are the periphery 32 on which the lead frame is mounted, and the longer sides and the rear faces 33 of the upper and lower plates 16a, 16b to which the lead frame is put closed. Thicknesses of the upper and lower plates 16a and 16b are ta and tb, respectively, and lengths of long and short sides thereof are land b, respectively. The package 16 is thus allowed to have improved resistance to shock and to quickly dissipate any heat generated in a semiconductor chip.
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