| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing sheet with a protective film formation layer which can easily produce a semiconductor chip having a protective film having high uniformity and superior printing precision, can easily perform peeling between the protective film and the dicing sheet, and has superior affixing ability of chips during dicing.SOLUTION: A dicing sheet with a protective film formation layer includes an energy ray curable protective film formation layer which is provided on, in a peelable manner, an adhesive layer of an adhesive sheet in which the adhesive layer containing an adhesive component and a free epoxy group-containing compound by being laminated onto a substrate film.SELECTED DRAWING: Figure 1 |
