| 摘要 |
PROBLEM TO BE SOLVED: To suppress damage or poor appearance, cut down manufacturing man-hours and manufacturing costs, and improve the efficiency of forming an optical thin-film in an optical device such as a semiconductor laser and an optical modulator.SOLUTION: In a light entry/emission end face machining process, a notch 9a is machined in a light entry/emission end face 1a so that the edge on light entry/emission end face 1a side of the counterface surface of an electrode formation surface 1b is inward of a shot 1 from the edge on light entry/emission end face 1a side of the electrode formation surface 1b with regard to the light entry/emission direction on the light entry/emission end face 1a. In a substrate laminate formation process, a laminate is formed in a plurality of shots 1 in which the notch 9a is machined in the light entry/emission end face 1a in such a way that the light entry/emission end faces 1a are almost in the same plane. In an optical thin-film formation process, an optical thin-film 10 is formed collectively on the almost coplanar light entry/emission end faces 1a in the plurality of shots 1 in which the laminate is formed.SELECTED DRAWING: Figure 7 |
