| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure for a circuit board which is capable of efficiently releasing heat even when a transient temperature increase occurs in an electronic component.SOLUTION: A heat dissipation structure for circuit board is intended to release heat generated in a circuit board 21 having an electronic component mounted thereon. The heat dissipation structure has a planar-shaped heat dissipation substrate 12 having a circuit board attached to one surface thereof. A heat dissipation block 14 having a relatively large heat capacity than a peripheral region is disposed in a central region of the other surface of the heat dissipation substrate 12 which corresponds to an attachment portion for the circuit board 21. This makes it possible to reduce transient thermal resistance and cope with a transient temperature increase.SELECTED DRAWING: Figure 2 |
