METHOD FOR MAKING A CONNECTION BETWEEN A BONDING WIRE AND A CONTACT PAD IN HYBRID THICK-FILM CIRCUITS

摘要

To prevent corrosion processes in the contact connection points in the interior of hybrid circuits at temperatures around or above approximately 200 DEG C, a diffusion barrier layer (5) is applied to the contact pad (connecting point 2). Said barrier layer (5) can be applied to the contact pad (2) by vapour deposition through masks (4) or by using a specially sheathed bonding wire (8, 9). The contact pad is produced during connection of a bonding wire (7, 8) to a conductor track (2) or a semiconductor chip (3).