| 摘要 |
PURPOSE:To improve integration of IC and to enable terminating resistance to be formed on a tape carrier without reducing wiring density even if the input part increases by providing resistance with the same value as the characteristics impedance of transmission line on an insulation film in array configuration and by forming an insulation layer with metal foil wiring which was laminated so that it may hold between. CONSTITUTION:Flexible insulation films, for example polyimide films 4 and 5, are laminated and metal foil conductor, for example, Cu foils 3 and 6 are wired to them, respectively. A wiring G is a transmission line with high-speed input signal and forms a conductor face 6 with terminal potential and a micro strip transmission line which was adjusted to be a certain characteristics impedance. And the wiring 3 is extended and wired to the hole of film carrier central part which was provided to mount chips and is thermally contactbonded through an electrode pad 9 and bump which were provided on a semiconductor chip 2. A resistor 8 such as Ni or Cr with the same value as the characteristics impedance of the wiring 3 is formed on the insulation film 5 or 4 and one edge of the wiring 3 and the resistor 8 is joined through a through hole 7a. Also, the other edge of the resistor 8 is joined 1 through the conductor 6 and a through hole 7b. |
