发明名称 Trench isolation process and structure
摘要 A structure and method for forming an isolation wall in an etched trench are described. The trench walls are covered by a thin silicon oxide layer and the trench conformally filled with an oxy-nitride mixture having a particular range of composition so as to produce a neutral to slight tensile stress in the oxy-nitride relative to silicon. The structure is very simple to fabricate and creates fewer defects in the silicon substrate than prior art techniques. Buried voids in the filled trench are eliminated.
申请公布号 US4825277(A) 申请公布日期 1989.04.25
申请号 US19870122086 申请日期 1987.11.17
申请人 MOTOROLA INC. 发明人 MATTOX, ROBERT;FONG, STEVEN
分类号 H01L21/762;(IPC1-7):H01L27/12;H01L29/06;H01L29/34 主分类号 H01L21/762
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