| 摘要 |
A multichip package comprises a multilayer wiring substrate, and an array of contact pads having the ability to make wiring change formed on an uppermost layer of the substrate. The multichip package further comprises a plurality of IC chips mounted on the substrate. Each contact pad includes a connection conductor portion, and a separable conductive portion connecting a chip to an internal conductive layer provided in the substrate and integrally joined to the connection conductor portion. A connection is deleted by cutting the separable conductive portion thereafter to connect a wire to the connection conductor for making a wiring change, thus realizing the multichip package provided with an engineering change contact pad having excellent connecting and cutting functions. Further, IC chips are mounted on the substrate by making use of a solder dam of polyimide resin formed by applying a photosensitive polyimide precursor solution to the substrate, thus providing good contact between the chips and the substrate.
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