发明名称 Method for depositing solder onto aluminum metal material
摘要 A method for depositing solder onto aluminum metal material comprises steps of: (a) activating the surface of aluminum metal; (b) substituting zinc for the surface of aluminum as activated; (c) forming a nickel coating film over the surface of the zinc-substituted layer on the aluminum metal material by the non-electrode plating; and (d) attaching soldering material onto the nickel coating film surface.
申请公布号 US4848646(A) 申请公布日期 1989.07.18
申请号 US19880246929 申请日期 1988.09.19
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 MORISHITA, MITSUHARU;IWATANI, SHIRO;NANBA, MITSUAKI
分类号 B23K1/20;B23K1/00;B23K1/19;B23K35/00;B23K35/14;H05K3/44 主分类号 B23K1/20
代理机构 代理人
主权项
地址