发明名称 |
Method for depositing solder onto aluminum metal material |
摘要 |
A method for depositing solder onto aluminum metal material comprises steps of: (a) activating the surface of aluminum metal; (b) substituting zinc for the surface of aluminum as activated; (c) forming a nickel coating film over the surface of the zinc-substituted layer on the aluminum metal material by the non-electrode plating; and (d) attaching soldering material onto the nickel coating film surface.
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申请公布号 |
US4848646(A) |
申请公布日期 |
1989.07.18 |
申请号 |
US19880246929 |
申请日期 |
1988.09.19 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
MORISHITA, MITSUHARU;IWATANI, SHIRO;NANBA, MITSUAKI |
分类号 |
B23K1/20;B23K1/00;B23K1/19;B23K35/00;B23K35/14;H05K3/44 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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