| 摘要 |
PURPOSE:To reduce a loss due to an impedance mismatching at the time of packaging a semiconductor device for high-frequency or high-speed switching on an external circuit substrate by providing a microstrip line to directly connect a semiconductor circuit formed on a semiconductor substrate to an external circuit. CONSTITUTION:The part of a microstrip line 12 to be drawn from an edge 12a opposite to a semiconductor substrate 13 accommodated inside a dielectric container 11 is inclined to an external circuit substrate 20, an inclined part 12c reaches a dielectric container surface to be in contact with or opposite in parallel to the external circuit substrate 20 surface, an edge 12b is formed, and it is connected to an external circuit 21 formed on the external circuit substrate 20. Thus, a lead wire in a conventional package does not need to be used, and the loss due to the mismatching of the impedance between the microstrip line and lead line can be eliminated. |
