HOT SOLDER STEAM LEVELING DEVICE FOR PCB,申请号KR19860012676U-传众专利搜索

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发明名称	HOT SOLDER STEAM LEVELING DEVICE FOR PCB
摘要
申请公布号	KR890005034(Y1)	申请公布日期	1989.07.29
申请号	KR19860012676U	申请日期	1986.08.21
申请人	CHANG IL	发明人	CHANG IL
分类号	H05K3/00;(IPC1-7):H05K3/00	主分类号	H05K3/00
代理机构		代理人
主权项
地址

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