发明名称 |
EPOXY RESIN COMPOSITIONS FOR SEALING SEMICONDUCTOR DEVICES |
摘要 |
Disclosed are epoxy resin compositions comprising essentially (A) multi-functional epoxy resins, (B) imide-modified silicone compounds, (C) phenolic novolaks having more than 2 OH groups, and (D) inorganic fillers. When cured, these compositions have excellent processability and lower internal stress as compared to a similar composition without the imide-modified silicone compounds. These compositions are useful for sealing semiconductor devices or other molding applications. |
申请公布号 |
WO8907627(A1) |
申请公布日期 |
1989.08.24 |
申请号 |
WO1989KR00003 |
申请日期 |
1989.02.15 |
申请人 |
LUCKY, LTD. |
发明人 |
KIM, MYUNG, JOONG;SONG, JU, OK;PARK, JUNG, OK |
分类号 |
C08K3/00;C08G59/00;C08G59/14;C08G59/40;C08G59/62;C08L63/00;H01L23/29;H01L23/31 |
主分类号 |
C08K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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