| 摘要 |
PURPOSE:To lower the sealing height by a method wherein a semiconductor element requires a substrate potential is mounted on a substrate with a facing. CONSTITUTION:A semiconductor element is supplied with a substrate potential by connecting a semiconductor pad 2 to a conductive bonding agent 3 using a bonding wire 4 after filling a facing 5 with the conductive bonding agent 3. Through these procedures, the sealing height can be lowered. |
