首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
BONDING METHOD FOR SEMICONDUCTOR SUBSTRATE
摘要
申请公布号
JPH01270281(A)
申请公布日期
1989.10.27
申请号
JP19880099670
申请日期
1988.04.21
申请人
FUJITSU LTD
发明人
UEDA TOSHIYUKI;MAEKAWA TORU
分类号
H01L31/0264;H01L31/08
主分类号
H01L31/0264
代理机构
代理人
主权项
地址
您可能感兴趣的专利
COMPUTER MOUSE PERIPHERAL
An Armour System
Accesorio para contenedores
Papel continuo con adhesivo activado
PYROGENICITY TEST FOR USE WITH AUTOMATED IMMUNOASSAY SYSTEMS
USE OF A COMPOSITION CONSISTING OF A COMBINATION OF HYDROQUINONE, FLUOCINOLONE ACETONIDE AND TRETINOIN, INTENDED FOR TREATMENT SIGNS OF PHOTOAGING OF THE SKIN
PROCEDIMENTO PER LA PRODUZIONE DI CANEDERLI SEMIFREDDO RIPIENI E PRODOTTO RISULTANTE
MOBILE VIRTUAL AND AUGMENTED REALITY SYSTEM
TRANSFER RATE CONTROL METHOD, TRANSMISSION POWER CONTROL METHOD, TRANSMISSION POWER RATIO CONTROL METHOD, MOBILE COMMUNICATION SYSTEM, MOBILE STATION, AND RADIO BASE STATION
Downhole multiple-cycle tool
A horse feeder wherein release of feed is controlled by a timer
Surveillance system and method
Use of autotransformer-like antennas for downhole applications
Anordning for begrensning av energien som benyttes i en dusj
UTSTYR FOR TRANSPORT OG GJENVINNING AV HYDROKARBONER FRA EN UNDERSJOISK BRONN FOR GJENVINNING AV HYDROKARBONER, UNDER UKONTROLLERTE UTSLIPPSBETINGELSER
床架(4)
荧光泡灯(C79A)
电动客车空调
数字电视机顶盒(TB2007)
智能四合一传感器