| 摘要 |
PURPOSE:To enhance the mold release characteristics by a method wherein silver plated films having non-adherence to a resin are formed on the surface of sealing dies. CONSTITUTION:Silver plated films 6, 5 respectively formed on the surface of top and bottom dies 4, 3 by electroplating process ares provided with mirror surface roughness not to exceed 0.1mum. The resin implanted into the sealing dies 3, 4 and specified to be an epoxy resin comprising acid anhydride base setting agent adheres firmly to a semiconductor element 1 and a lead frame 2 but not to the dies 4, 3 on the surface of which the silver plated films 5, 6 having non-adherence to thin resin are formed so that the resin may be released without injuring the visual appearance even if no outer mold release agent is applied at all. Through these procedures, the mold release characteristics can be enhanced.
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