发明名称 Arrangement for connecting electronic modules and components
摘要 The invention is used in the manufacture of microelectronic functional units for connecting modules and components, for which purpose plug connectors and solder connections are known. Plug connectors are complicated and expensive components. Solder connections are simpler and quicker to make, but have the drawback that the often required capability to detach them, at least in principle, is not provided. The aim of the invention is to avoid expensive plug connectors and replace them by solder connections. The object of the invention is to provide a multipole solder connection which is nevertheless easy to detach and reproduce. This object is achieved, according to the invention, by fitting the arrangement according to the invention between the elements to be connected, which arrangement has a base body in which the contact pins are integrated with solder surfaces, and is characterised in that it has at least one, preferably electrical, heating device as well as associated connecting elements for supplying the heat energy. With activation of the heating device, the base body is heated and, with it, the solder surfaces, and the solder present on the latter is thus melted. Dismantling or assembly of the connection is then possible. After deactivation of the heating device the operation is finished. The invention has substantial advantages in comparison with plug connectors wherever multipole contacts are made or detached only very rarely... Original abstract incomplete. <IMAGE>
申请公布号 DE3821473(A1) 申请公布日期 1989.12.28
申请号 DE19883821473 申请日期 1988.06.25
申请人 INGENIEURHOCHSCHULE FUER SEEFAHRT WARNEMUENDE/WUSTROW, DDR 2530 WARNEMUENDE, DD 发明人 MENNENGA, HEYO, PROF. DR.SC.TECHN., DDR 2520 ROSTOCK, DD
分类号 H01R4/02;H05K1/02;H05K1/14;H05K1/16;H05K3/34;H05K3/36 主分类号 H01R4/02
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