| 摘要 |
PURPOSE: To obtain the semiconductor chip package which is applicable to various kinds of semiconductor chip by making it possible to electrically connect a general-purpose programmable pad and a connector together and constituting a power source and ground connection on the surface of the package. CONSTITUTION: A power source at the bottom part of the package, a power source to a ground connector, and a ground connection are connected by a via hole 28 of a layer 2 right below a selected programmable pad 26 of the layer 1 through 248 programmable pads 26 of the layer 1 from the via hole 28 of the layer 2 to a via hole 28 right above a corresponding ring of a layer 3 horizontally up to a power source and further this power source extending the ground pad 32 to a corresponding ring of the layer 3. Consequently, this semiconductor package is applicable to various kinds of semiconductor chip. |
