| 摘要 |
<p>PURPOSE:To make a signal pattern large in a cross section by a method wherein two or more patterns are provided to each wiring circuit. CONSTITUTION:A thin board formed of ceramic, on which a pattern 14-1 is printed to have a designated path, and a ceramic thin board, on which a pattern 14-2 is printed, are made to face each other to form a signal layer 14 in such a manner that each pattern is separate from a central plane of the thickness of a laminated board by a certain space. By these processes, the patterns 14-1 and 14-2 are wired in accordance with a designated path respectively. Surface layers 2 are laminated on both the sides of the signal layer 14 through the intermediary of a GND layer 3, which is provided onto a primary face of a board, and bonding pads, connecting terminals, and the patterns 14-21 and 14-2 are constituted to be connected with each other through a VIA.</p> |
