| 摘要 |
PURPOSE:To provide a heat exchanger in excellent structure for repairing after assembly without impairing the cooling performance according to conventional arrangement by constructing heat exchanger by means of soldering voidlessly so that either of the LSI chip and coolant is fixed firmly. CONSTITUTION:An LSI chip 11 mounted on a wiring board 10 is electrically connected thereto by a solder bump 14, and a cooling block 13 is airtightly connected to a refrigerant passage 16 by flexible stainless steel bellows 15. By vacuum evaporation method a metallized layer 17 is formed on the back face of this LSI chip 11 in the sequence of Ti, Pt, and Au. The surface of block 13 in contact with a solder layer 12 is finished by grinding into mirror surface condition. Solder of Pb-Sn series is used to this solder layer 12, and soldering is performed using an adjusting process for atmosphere pressure, and the space between the back face of LSI chip 11 and the mirror surface of cooling block 13 is filled densely with molten solder, and the solder layer 12 undergoes intermetal reaction with the metallized layer 17 to accomplish fast attachment. This provides a heat exchanger in the structure having low heat resistance with no gaps between the LSI chip 11, solder layer 12, and cooling block 13.
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