| 摘要 |
PURPOSE:To correspond with a different kind of package by using the same semiconductor chip by a method wherein a bonding pad to be used is selected according to the kind of package, and a lead frame according to each package is used. CONSTITUTION:For example, an insulating sheet 4 is bonded on a retaining plate 3 and the inner lead parts of lead L4, L11, L12, and a semiconductor chip 1 of 4MDRAM is mounted on the insulating sheet 4. The lead frame is formed of copper alloy or iron nickel alloy, and the insulating sheet 4 of polyimide resin and the semiconductor chip 1 are mounted, by using adhesive agent or by compression bonding. Bonding parts of leads L1-L3, L11-L20 and the bonding pads P1-P3, P8, P9-P13, P20-P30 on a semiconductor chip are connected electrically by using bonding wires W. When this wire bonding is finished, a resin seal type semiconductor device is completed by a resin seal process, In this case, epoxy resin is used as sealing resin. |
