Method for sloping the profile of an opening in resist

摘要

A lithography method for forming an opening in a resist layer with a sloped profile is disclosed which requires no additional processing steps or equipment. A scattering element, for example a ground glass diffuser, is placed in the optical path of radiation passing through a standard lithography apparatus. The scattering element modifies the radiation passing through the lithography apparatus with the result that the developed resist profile exhibits sloped edges. The slope modification can be conveniently changed by exchanging the optical scattering element used.