| 摘要 |
PURPOSE:To make it possible to form patterns continuously on a substrate by a wet method in the entire manufacturing process by drawing and forming a circuit pattern on an insulating substrate on which a conductor layer is formed with laser in plating liquid, using the pattern as a mask, and etching the conductor layer. CONSTITUTION:A copper foil is attached to an insulating substrate 1, or electroless copper plating is applied on the entire surface of the substrate 1. The insulating substrate 1 undergoes activating treatment. The substrate is set in a plating cell. Plating liquid is made to flow on the surface, and a Iaser beam is projected. Then metal is deposited at that part. The surface is scanned with the beam in accordance with the CAD data, and a circuit pattern 3 is drawn. Then, the substrate is immersed into ferric chloride solution. The copper at the part where the metal mask pattern 3 is not formed is dissolved. The copper 4 at the circuit pattern is made to remain. As the masking metal, gold, nickel, tin or tin/lead alloy which is not erroded with said solution is used. The function is not affected in either case when the metal is dissolved and removed or made to remain after the formation of the pattern. |
