| 摘要 |
PURPOSE:To prevent migration even if the baord is used at high humidity and to improve reliability by providing conductor circuits, a resistor layer and an insulating layer on a ceramic board, providing an amorphous glass layer on the surface, and forming an organic resin layer as an outermost layer. CONSTITUTION:On a ceramic board 1, conductor circuits 2 and 2', a resistor layer 3 and insulating layers 4 are formed by a well known method. An amorphous glass layer 5 is formed on the surfaces of said parts. Thus a thick film wiring board is obtained. An organic resin layer 6 comprising heat resisting alkyd resin and the like is heated and formed so as to cover the upper surface of the board. Even if the board is used at a high temperature of 85 deg.C and at a high relative humidity of 85% RH, the insulating resistance at a part where the conductor circuits are intersected is hardly decreased. Migration is not caused. When the baord is used in ICs and the like, high reliability can be obtained. |
