发明名称 Method for positioning and clamping of multilayered circuits and means and device for the application of the method.
摘要 When hot-pressing multilayered circuits with an evacuated bag, the problem arises how to place the circuit boards without projecting parts on top of one another to fit exactly and how to clamp them. …<??>A novel method for positioning and clamping a plurality of circuit boards (6, 7, 8, 9, 10) is proposed, in which sliding members (1) made of thermoplastic material are positively inserted across its width into oblong holes of the boards (6, 7, 8, 9, 10) and are deformed. The circuit boards (6, 7, 8, 9, 10) are longitudinally displaceable on the sliding member (1) so that thermal expansions are compensated. …<??>The sliding member (1) is in its length of cylindrical design with two sliding faces (3) and a continuous central bore (2). …<??>The tool for deforming the sliding member (1) has a cylindrical heating element with a central bore, in which a centering pin is provided. The heating element is surrounded by a pressure tube which is displaceable in a sleeve against a compression spring. …<IMAGE>…
申请公布号 EP0368809(A1) 申请公布日期 1990.05.16
申请号 EP19890810835 申请日期 1989.11.06
申请人 FELA PLANUNGS AG 发明人 ZUST, HARRY, DR. SC. DIPL.-ING. CHEM. ETH
分类号 B30B15/30;B23Q3/18;B29C65/60;B29C65/78;B29C70/54;B30B15/34;F16B5/04;F16B19/10;H05K3/46 主分类号 B30B15/30
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