METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING PACKAGE STRUCTURE

摘要

A method of manufacturing a semiconductor device having a package structure including a lead base and a cap includes the steps of fixing a semiconductor chip to a lead base, and placing a fixation pellet in a cap, the fixation pellet being made of a material which melts and is subsequently hardened by a rise in temperature. The lead base carrying the semiconductor chip upside-down on the fixation pellet is placed in the cap. The fixation pellet between the cap and the lead base carrying the semiconductor chip is then heated to melt the fication pellet and subsequently harden the melted fixation pellet. Thus, the lead base carrying the semiconductor chip is fixed to the cap to form a package structure.