| 摘要 |
PURPOSE:To enable easy correction of impedance of a surface layer circuit pattern to a desired value by applying a dielectric layer of a specified thickness onto the surface layer circuit pattern according to a value of measured characteristic impedance value. CONSTITUTION:Impedance of a surface layer circuit pattern 11 of a printed board which is provided with the surface layer circuit pattern 11 is measured. Then, a solder resist film 21 is applied to a surface of a substrate according to a measurement value of the measured impedance using squeegee for printing. After the solder resist film 21 is dried, the impedance of the surface layer circuit pattern 11 is measured again, and if the measurement value is not the same as a desired standard value, a solder resist film 21 is further applied. This operation is repeated until a desired impedance value is acquired. The impedance can thereby be corrected to a desired value through a simple method. |
