Process of making diazoquinone sensitized polyamic acid based photoresist compositions having reduced dissolution rates in alkaline developers
摘要
The dissolution rate in alkaline developer solutions of image-wise exposed photoresist systems based on diazoquinone sensitized polyamic acid is reduced to prepare relief images of fine line resolution by reducing the acidity of the polyamic acid prior to exposure.
申请公布号
US4942108(A)
申请公布日期
1990.07.17
申请号
US19890404700
申请日期
1989.09.08
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
MOREAU, WAYNE M.;CHIONG, KAOLIN N.;CHOW, MING-FEA;SNYDER, NANCY W.