| 发明名称 |
SEMICONDUCTOR DEVICE PACKAGE |
| 摘要 |
A semiconductor device package which decrease deterioration on characteristics of the chip is provided.;The semiconductor device package includes a chip having a plurality of electrodes and a circuit, each of the electrodes provided on a first surface of the chip, the circuit being connected to the electrodes, a resin member provided on the first surface of the chip, and an encapsulating member encapsulating the chip and the resin member.;Elastic modulus of the resin member is set in a prescribed range such that drift of an output voltage of the circuit is in a range within not less than 0.0 mV and not more than 1.5 mV. |
| 申请公布号 |
US2016351464(A1) |
申请公布日期 |
2016.12.01 |
| 申请号 |
US201615166766 |
申请日期 |
2016.05.27 |
| 申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Kishi Hiroaki |
| 分类号 |
H01L23/31;H01L23/495;H01L23/29;H01L23/00 |
主分类号 |
H01L23/31 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device package, comprising:
a chip having a plurality of electrodes and a circuit, each of the electrodes provided on a first surface of the chip, the circuit being connected to the electrodes; a resin member provided on the first surface of the chip; and an encapsulating member encapsulating the chip and the resin member; wherein elastic modulus of the resin member is set in a prescribed range such that drift of an output voltage of the circuit is in a range within not less than 0.0 mV and not more than 1.5 mV. |
| 地址 |
Tokyo JP |
