| 发明名称 |
Apparatus for transmitting heat under vacuum by grains |
| 摘要 |
A heat transmission apparatus is formed between a thermal source (12) and an object (21) in a vacuum enclosure (1) by placing in a cavity defined by a heat emission wall (20) and the object (21), a granular material (30) which adapts to the thermal expansions, while permitting heating by conductivity under very good conditions. Possible application to the manufacture of semiconductors and the crystallization of thin films.
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| 申请公布号 |
US4990754(A) |
申请公布日期 |
1991.02.05 |
| 申请号 |
US19890346731 |
申请日期 |
1989.05.03 |
| 申请人 |
COMMISSARIAT A L'ENERGIE ATOMIQUE |
发明人 |
BECHEVET, BERNARD;CALVAT, CLAUDE;ROLLAND, BERNARD;VALON, BRUNO |
| 分类号 |
H01L39/24;B01J3/00;C23C14/22;C23C14/24;C30B25/10;F27B5/04;F27B17/00;F27D99/00;H01L21/00;H01L21/203;H05B3/60;H05K7/20 |
主分类号 |
H01L39/24 |
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