| 摘要 |
PURPOSE: To make a cut point in a short-circuited region or a conductor bridge through cutting by vibrating a printed wiring board in parallel with the surface thereof, feeding a cutter in parallel with the surface of the printed wiring board and making a cut vertically stepwise. CONSTITUTION: After approaching a cut position on an x-y table (not shown), cutting process is performed by feeding a cutter St in a machining direction, e.g. y-direction, and making a cut Z. Feeding V and cutting Z can be performed through corresponding motion of an ultrasonic head Uk or a printed wiring board holder. For example, cutting Z is performed at a step of 5-10μm while feeding V is performed at a rate of 0.5-1.0m/min. The width (b) at a cut position Tf corresponds to the width B of the cutter. Chips are sucked when the cut position Tf is cut stepwise and removed only at the time of feeding.
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