发明名称 Printed Circuit Board Components
摘要 An electronic device may include surface mount technology components mounted to a printed circuit board. The surface mount technology components may include electrical components such as resistors, inductors, and capacitors. In order to reduce the size of the electronic device, surface mount technology components may be stacked. A surface mount technology component may be mounted to metal members that electrically connect the surface mount technology component to contact pads on a printed circuit board. A surface mount technology component may be provided with integral standoff portions, and a second surface mount technology component may be mounted to the integral standoff portions. A single surface mount technology component may be used to implement different circuits depending on which face of the surface mount technology component is mounted to the printed circuit board.
申请公布号 US2016366765(A1) 申请公布日期 2016.12.15
申请号 US201514843000 申请日期 2015.09.02
申请人 Apple Inc. 发明人 Martinez Paul A.;Bushnell Tyler S.;Sauers Jason C.
分类号 H05K1/18;H05K7/02;H05K1/14 主分类号 H05K1/18
代理机构 代理人
主权项 1. An apparatus comprising: a first surface mount technology component having: a dielectric body with a lower surface and an opposing upper surface;an electrical component mounted within the dielectric body;first and second electrical component pads on the lower surface that are coupled respectively to first and second terminals of the electrical component and that are configured to be coupled respectively to first and second printed circuit board contacts; andfirst and second standoff portions at opposing ends of the dielectric body that are electrically isolated from the first and second electrical component pads and that each have a lower pad on the lower surface of the dielectric body that is shorted to an opposing upper pad on the upper surface of the dielectric body; and a second surface mount technology component having first and second pads coupled respectively to the upper pads of the first and second standoff portions, wherein the lower pads of the first and second standoff portions are configured to be coupled respectively to third and fourth printed circuit board contacts.
地址 Cupertino CA US