CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

Disclosed are a circuit board and a method of manufacturing the same. The circuit board includes a core layer comprising a first surface and a second surface opposing the first surface, at least one first build-up layer formed on the first surface, and comprising a first conductive pattern and a first conductive via, at least one second build-up layer formed on the second surface, and comprising a second conductive pattern and a second conductive via, a cavity formed to pass through the core layer, the first build-up layer and the second build-up layer, and a heat dissipation unit disposed inside the cavity, and an outer layer formed on a surface of the first build-up layer and a surface of the second build-up layer and the outer layer being configured to be connected to the heat dissipation unit.

主权项

1. A circuit board comprising:
a core layer comprising a first surface and a second surface opposing the first surface; at least one first build-up layer formed on the first surface, and comprising a first conductive pattern and a first conductive via; at least one second build-up layer formed on the second surface, and comprising a second conductive pattern and a second conductive via; a cavity formed to pass through the core layer, the first build-up layer and the second build-up layer, and a heat dissipation unit disposed inside the cavity; and an outer layer formed on a surface of the first build-up layer and a surface of the second build-up layer and the outer layer being configured to be connected to the heat dissipation unit.