| 摘要 |
PURPOSE:To control the form of a resin and to form a resin molded material having a good form by a method wherein a substrate with a semiconductor chip mounted thereon is held horizontally, the resin is dripped on the chip to apply on the chip and vibrations are imparted to the substrate. CONSTITUTION:A resin 7 dripped on a semiconductor chip 2 from a syringe 6 protrudes high in an inverted V shape because it has a high viscosity. Therefore, wires 8 for connecting a substrate 1 with the chip 2 are partially exposed. There, a vibrating means 4 is driven and when the substrate 1 is made to vibrate in the vertical directions, the resin 7 is fluidized to its side and is smoothed and the form of the resin 7 becomes good. In this case, the more the number of vibrations and an amplitude are large and the more a time to impart vibration is long, the more the resin 7 is flatly smoothed. Accordingly, the form of the resin 7 can be controlled by changing these. A molded material for protecting the chip 2 is formed by making this resin 7 heat and cure. |
