发明名称 |
LEADFRAME FOR SEMICONDUCTOR DEVICE |
摘要 |
A lead frame for a semiconductor device includes a metal strip made of copper or copper alloy having a plurality of wire bonding areas to which metal wires are directly connected by a direct bonding method. The wire bonding areas are electroplated with a thin silver film or a palladium film, so that formation of a copper oxidized film on the wire bonding area is substantially prevented. |
申请公布号 |
KR910008986(B1) |
申请公布日期 |
1991.10.26 |
申请号 |
KR19880005384 |
申请日期 |
1988.05.10 |
申请人 |
SHINKO ELECTRIC IND. CO. LTD. |
发明人 |
MURATA AKIHIKO;SHIMADA TOSHIHIKO |
分类号 |
H01L23/50;H01L23/495 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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