| 摘要 |
PURPOSE:To obtain a printed circuit board with a high reliability as an electric circuit and with a satisfactory reproducibility by forming a required circuit pattern on at least one principal plane of a thermoplastic resin plate, applying heating and pressing molding thereto and embedding the circuit pattern so that a circuit pattern surface is flush with the surface of the thermoplastic resin plate. CONSTITUTION:A copper foil sticked polycarbonate resin plate 1 wherein a copper foil 2 is sticked to the principal plane of, for instance, a polycarbonate resin plate 1 as a support base material is prepared. Photo-etching processing is applied to the copper foil 2 of the copper foil sticked polycarbonate resin plate 3 and a required outer layer circuit pattern 4 is formed. Thereafter, a printed circuit board 5 is molded by heating and pressing. By thus molding by heating and pressing, the outer layer circuit patterns 4 are embedded in the surface of the polycarbonate resin plate 1 as separated from one another to obtain a desired printed circuit board 6 flush with the support base material 1. |
