发明名称 WAFER DELIVERY DEVICE
摘要 PURPOSE:To obtain a wafer delivery device which prevents dusts and particles produced from human bodies from adhering onto a wafer by providing a pawl which holds and retains a side surface of the wafer and a shifting mechanism which shifts this pawl. CONSTITUTION:This wafer delivery device is placed between a hot plate 8 of an SGO coating device which is placed at a common base and a rotary stage 10 of an alkali solution treatment device. Then, it has two pawls 1a and 1b which hold and retain both side surfaces of a wafer 9 with pressure of a spring 5, a spindle 7 which has the same center as a support opening and closing these pawls 1a and 1b, an electromagnetic solenoid 6 which is an expansion and contraction device which opens the pawls 1a and 1b against pressure of the spring 5 and is mounted at multiple edges of the pawls 1a and 1b, an arm 2 which is extended from one edge of the spindle 7, and a column 3 which performs up/down rotary motion in a direction shown by arrows 14, 15a, and 15b. After SOG coating ends while this nib retains the wafer, no man-power is needed for performing alkali solution treatment, thus performing a consistent treatment automatically.
申请公布号 JPH03296228(A) 申请公布日期 1991.12.26
申请号 JP19900099671 申请日期 1990.04.16
申请人 NEC CORP 发明人 HONDA TOSHIYUKI
分类号 H01L21/30;H01L21/027;H01L21/463;H01L21/66 主分类号 H01L21/30
代理机构 代理人
主权项
地址