发明名称 CURING APPARATUS
摘要 PURPOSE:To always cure in a predetermined quality by supplying high temperature gas diffused by a diffusion plate in a high temperature gas supply chamber to uniformarize the temperature distribution to works. CONSTITUTION:A work 18 bonded with a die 17 through a thermosetting adhesive 16 to a lead frame 15 is sequentially conveyed on a heating block 6 to be cured. Since high temperature gas 9 supplied into a high temperature gas supply chamber 5 via a pipe 10 collides with a diffusion plate 11 and enters the chamber 5, it is mixed to become vortex flow. Accordingly, it is diffused without irregular temperature distribution in the chamber 5 to gain a uniform temperature distribution. Since the gas 9a of a uniform temperature distribution due to diffusion is supplied to the work 18 through a slit 2, it is always cured in a predetermined quality.
申请公布号 JPH045838(A) 申请公布日期 1992.01.09
申请号 JP19900105301 申请日期 1990.04.23
申请人 SHINKAWA LTD 发明人 ARAI MITSUO
分类号 H01L21/52 主分类号 H01L21/52
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