| 摘要 |
PURPOSE:To improve reliability of soldering by subjecting conductive parts of a flexible substrate and a rigid substrate in opposition to laser beam soldering by driving a member having laser beam transmittance and rigidity of a pressurization part. CONSTITUTION:First and second members 16 and 20 having the laser beam transmittance, elasticity and rigidity are superposed on each other to provide the pressurization part 21. In a state with a first conductive part (terminal part) 4a and a second conductive part (terminal part) 2a which are solder-plated respectively positioned in opposition on the flexible substrate 3 and the rigid substrate 1 in opposition, the second member 20 of the pressurization part is driven and laser beam soldering is performed by laser beam irradiation heating of a laser beam irradiation part 34. Consequently, since both conductive parts 4a and 2a are surely pushed each other with the same force and laser beam hating is carried out so as to attain the set temperature, reliability of soldering can be improved. |
