| 摘要 |
PURPOSE:To prevent occurrences of scatter in heights of bumps and avoid some of remainders of tail which causes defective connection at the cutting part of a bump and then, form the bump which is compact and is stable in shape by making junctions of the pointed end of a metallic fine line with electrodes or the like by pressing while loading ultrasonic waves and further, cutting the junctions and the fine line. CONSTITUTION:In a method for forming a bump 6 which is provided between electrodes 2 that are formed on a semiconductor element 1 and an inner lead and further, connects both electrodes and the inner lead, the pointed end 3a of a fine line 3 is junctioned with the electrodes or the inner lead by pressing a part that is located along the longitudinal direction of the fine line 3 in the pointed end 3a of the metallic fine line 3 while loading ultrasonic waves. Then, junctions mentioned above and the fine line 3 are cut in such a way that, for example, the metallic fine line 3 made of Al, an alloy of Al, Cu, an alloy of Cu, Au, an alloy of Au or the like is inserted slantwise into the tool 4 of a wedge bonder and the pointed end of the fine line is located at a pressed face 5 that is formed at the lower face of the tool 4 and the pointed end 3a of the fine line 3 is junctioned with each electrode 2 by lowering the tool 4. |
