| 摘要 |
PURPOSE:To uniformly suck and discharge a solvent even when the length of an oven in a heat treatment section becomes longer in a device which makes heat treatment by moving a body to be treated and another body making heat treatment relatively to each other by performing the heat treatment in a state where the solvent, etc., is discharged from exhaust ports provided along the side section of the body to be treated. CONSTITUTION:A semiconductor wafer 20 to which a resist is applied is placed on a hot plate 22 provided in a heat treatment section 21 and dried by heating at a high temperature while a solvent, etc., is discharged. Since the wafer 20 is carried by means of a walking beam 23 and, at the same time, the solvent, etc., is discharged through exhaust ports arranged in upper sections on both sides along the carrying direction of the wafer 20, the solvent, etc., is always discharged not only from the central part of the heat treatment section 21, but also from the entire area in the heat treatment section 21, and the discharge is uniformly made throughout the entire stage. In addition, a discharge-side wall 24 and cover member 27 are provided in removable states so that maintenance work can be made easily to them and exhaust pipes 24 are arranged at regular intervals so that the solvent can be suck and discharged uniformly. |
