发明名称 |
ETCHING AND DEVELOPING METHOD |
摘要 |
PURPOSE:To etch or develop the entire surface of a substrate by moving the substrate placed on a conveyor, oscillating a liq. chemical pipeline having a nozzle and an air pipeline having a nozzle and simultaneously injecting the chemical and air. CONSTITUTION:A liq. chemical pipeline 1 having plural nozzles 2 is arranged in plural columns in the traveling direction (to the (a) direction in the figure) of a conveyor 5 for a substrate 4. An air pipeline 6 having nozzles 7 is arranged in plural columns A-F in parallel with the chemical pipeline 1. The chemical pipeline 1 and the air pipeline 6 are oscillated, and the chemical and air are simultaneously injected on the substrate 4 respectively from the nozzles 2 and 7. Consequently, the entire surface of the substrate is uniformly etched or developed. |
申请公布号 |
JPH0448087(A) |
申请公布日期 |
1992.02.18 |
申请号 |
JP19900158003 |
申请日期 |
1990.06.15 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
ISHIKAWA MASAHARU;KASAI YOSHIHARU;SHIRAKI HIROYUKI;KANEKO JUNJI |
分类号 |
G03F7/30;C23F1/00;C23F1/08;H05K3/06 |
主分类号 |
G03F7/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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